Diamond Sawing
Sawing depth up to 100+ mm.
Excellent surface quality.
Width of the laser beam kerf in Parallel Sawing dependent on the depth of the processed diamond material.
for depth up to 10mm - kerf width : 70um
for depth up to 12mm - kerf width : 100um
Sawing kerf : "V"kerf
Straight Line ("V" tilted)
Parallel kerf
Sawing processes : Standard Sawing
Two-Side Sawing (TSS)
Pie-Sawing
Scoop-Sawing
Requires use of TSS-360 Cassette or iTSS Cassette.
Suitable for manufacturers of synthetic diamond materials and for gem-diamond manufacturers.